• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The method for producing the heated spinneret of the present invention relates to electronic heating, which can be used to heat the housing and the work area and also to dry wood, sand and grains. The method is carried out as follows: The substrate 1 is prewashed and cleaned, the oil is removed and dried, and the conductive coating 2 is applied. The composite of the conductive coating is prefiltered and formed on the dielectric substrate 1 using known methods such as spraying, dipping or drying. When necessary, the application of the composite to the dielectric substrate and its drying are repeated several times. Thereafter, an additional conductive coating in the form of a strip is formed. The strip 3 has a different structure with respect to the required heat range of the heating radiating plate. The protective layer 4 is formed on the conductive coating 2 and the additional conductive coating 3.
    公开号:KR20030021171A
    申请号:KR1020027017060
    申请日:2001-07-26
    公开日:2003-03-12
    发明作者:알렉사이비탈레비치 골로벤코프；바딤르보비치 코즐리코프；맥심알렉산드로비치 마르케비치
    申请人:오브체스트보 에스 오르가니첸노이 오트베트스트벤노스티쥬 "퍼마 아트토콤+"；
    IPC主号:
    专利说明:

    Method for producing heating radiating plate {Method for producing heating radiating boards}
    [2] A known technique is the method of manufacturing the spin plate (RU A, 2141177). The conductive coating layer is formed on a preformed dielectric or metal substrate using known methods, after which the substrate is dried to remove the solvent and a protective layer is formed thereon. If necessary, the operation of forming the conductive coating layer, drying and forming the protective layer is repeated. As a result, the heated spinneret is more efficient and quickly warms the room. However, such a method does not obtain a heating radiating plate having a constant temperature range for the user.
    [1] TECHNICAL FIELD This invention relates to an electronic heating apparatus. It is related with the manufacturing method of what is called a heating radiation plate.
    [9] 1 is a general view of a heated spinning plate according to a first embodiment of a method of forming an additional conductive coating layer.
    [10] 2 is a cross-sectional view of the heating radiating plate shown in FIG. 1.
    [11] 3 is a view of a heated spinning plate according to a second embodiment of a method of forming an additional conductive coating layer.
    [12] 4 is a cross-sectional view of the heating radiation shown in FIG. 3.
    [13] 5 is a diagram of a heated spinning plate according to a third embodiment of a method of forming an additional conductive coating layer.
    [14] 6 is a cross-sectional view of the heating radiating plate shown in FIG. 5.
    [15] In the drawings, the following reference numbers are used. Reference numeral 1 is a substrate, 2 is a conductive coating, 3 is a strip of additional conductive coating layer, 4 is a protective layer, 5 is a first bus of the power supply, 6 is a second bus of the power supply.
    [3] It is a primary object of the present invention to provide a method of manufacturing a heated spinneret, which enables the manufacture of a heated spinneret having a constant or predetermined temperature range and having high operational reliability.
    [4] This object is achieved by a method of manufacturing a heated radiation plate comprising forming a conductive coating on a dielectric substrate having power supply busses, forming a protective layer and drying a half finished product. Prior to forming the protective layer on the conductive coating according to the invention, an additional conductive coating is formed in the form of at least one strip of any form. The end of the strip described above is perpendicular to the power supply buses. The strip form described above is selected depending on the parameters of the temperature range preset in the heating spinneret.
    [5] The object of the present invention is also achieved by providing a method of manufacturing a heated radiation plate comprising forming a conductive coating on a dielectric substrate having power supply buses, and forming and drying a protective layer. Prior to forming the protective layer on the conductive coating in accordance with the present invention, the ends of the at least one strip of any form are cut in the dielectric of the substrate.
    [6] The end of the strip described above is perpendicular to the power supply buses. The shape of the strip described above is selected depending on the preset temperature range parameters.
    [7] The result achieved by using the method of manufacturing a heated radiating plate as claimed is not only an increase in the reliability of the heated radiating plate, but also a certain temperature range of the heating radiating plate due to the proper selection of the strip form of the additional conductive coating layer.
    [8] The invention is described in several embodiments with reference to the accompanying drawings, but does not limit the scope of the invention.
    [16] The method according to claim 1 of the claim set is achieved as follows.
    [17] As shown in FIGS. 1 and 2, the substrate 1 may be made of a metal having a protective dielectric layer or may be made of a dielectric material such as glass reinforced plastic.
    [18] The substrate 1 is preliminarily washed by wiping with sandpaper to obtain a good adhesive layer. Subsequently, the substrate 1 is rinsed in running water. For final cleaning, oil is removed by wiping the substrate 1 with alcohol. Subsequently, the substrate 1 is dried at a temperature of 60 ° C to 80 ° C. While performing the preliminary operations described above, the substrate 1 is interviewed with the conductive coating 2. Depending on the power source required to obtain radiation, the conductive coating 2 may be made of metal or synthetic material. The metal conductive coating 2 is used consisting of either metal flakes or vacuum-plasma metal sprayed onto a layer that is subsequently grown at the required resistance level to increase the specific power of heatfluxes and to simplify the coating technique. . The conductive coating metal may be copper, aluminum, stainless steel, nickel, or the like. The resistance of the metal conductive coating 2 is selected to be provided at a specific heat generating power in the range of 10 to 25 kw / m at a power supply voltage of 20V to 50V.
    [19] One example is considered when the conductive coating is made of synthetic material. The composite of the conductive coating 2 can be prepared as follows.
    [20] The film forming the polymer-polycarbonate ester is dissolved in a chlorine-containing solvent and filler-carbon black is added to the resulting solution. The resulting composite is filtered to separate it from the large particles of the filler. The composite of the conductive coating 2 is formed on the dielectric substrate 1 using known methods such as dispersion or immersion. Thereafter, a drying process is performed to remove the solvent. In doing so, the drying temperature is selected depending on the solvent form. If necessary, the steps of forming and drying the composite on the conductive coating 2 on the dielectric substrate 1 are repeated several times until the required resistance of the conductive coating 2 and the given resistance law are achieved. .
    [21] Thereafter an additional conductive coating is made. The structure of the additional conductive coating differs as their combination of strips, broken strips and snake shapes. The choice of structure of the additional conductive coating depends on the temperature range to be achieved. In one example, the additional conductive coating is made as a single strip whose end is perpendicular to each of the first power supply bus 5 and the second power supply bus 6. The operation of forming the strip 3 can be carried out by the dispersion of the composite of the conductive coating through a stencil. In doing so, the user can easily obtain strips of any form. The drying operation is then carried out as described above. Finally, the protective layer 4 is formed and dried to provide mechanical and electrical protection of the conductive coating 2 and the strip 3. The composite of the protective layer 4 can be obtained by dissolving the film forming the polymer with a suitable solvent.
    [22] According to the method of claim 2 of the claim set, the operation of preparing the substrate 1 and the formation of the conductive coating layer 2 are made as described in the method of claim 1. Thereafter, as shown in FIGS. 3 and 4, one or several strips, for example two strips 7, are cut from the conductive coating 2 to the dielectric of the substrate 1. By doing so, the strip 7 has a different shape. However, the ends of these strips 7 must be perpendicular to each of the first power supply bus 5 and the second power supply bus 6. Forming and drying the protective layer 4 thereafter as described above provides mechanical and electrical protection of the conductive coating 2 and the strip 7.
    [23] According to the method of claim 3 of the claim set, the operation of preparing the substrate 1 and the forming of the conductive coating layer 2 are carried out as described in the method of claim 1. Thereafter, as shown in FIGS. 5 and 6, one or several strips, for example two strips 7, are cut from the conductive coating 2 to the dielectric of the substrate 1 while at the same time an additional conductive coating is It is formed as (3). In such a method of manufacturing a multilayer board, the specific power source of heating radiation is in the range of 2.0 to 5.0 kw / m at a supply voltage of 100 to 250V.
    [24] The claimed embodiments of the method of making a heated spinneret therefore allow the user to adjust the temperature range by having a constant resistance of the heated spinneret surface. The operating reliability of the plates is increased, for example when the power supply voltage is boosted, the plates are heated at high speed. In this case only a small part of the plate can fail instead of the whole plate. The broken part of the plate can be easily repaired.
    [25] The present invention can be used for heating in living and product plants as well as in the industry of drying wood, sand and grains.
    权利要求:
    Claims (3)
    [1" claim-type="Currently amended] 1. A method of manufacturing a heated radiation plate comprising forming a conductive coating having power supply busses on a dielectric substrate and forming and drying a protective layer, the method comprising:
    Before forming the protective layer on the conductive coating, an additional conductive coating is formed in the form of one or more strips of any form,
    The ends of the strip are perpendicular to the power supply buses,
    And wherein said strip form is selected depending on a parameter of a preset temperature range of said heated spinneret.
    [2" claim-type="Currently amended] 1. A method of manufacturing a heated radiation plate comprising forming a conductive coating having power supply busses on a dielectric substrate and forming and drying a protective layer, the method comprising:
    One or more strips of any form are cut to the dielectric layer of the substrate prior to forming the protective layer on the conductive coating,
    The ends of the strip are perpendicular to the power supply buses,
    And wherein the strip shape is selected depending on a parameter of a preset temperature range of the heated spinneret.
    [3" claim-type="Currently amended] 1. A method of manufacturing a heated radiation plate comprising forming a conductive coating having power supply busses on a dielectric substrate and forming and drying a protective layer
    Prior to forming the protective layer on the conductive coating, one or more strips of any form are cut to the dielectric layer of the substrate and an additional conductive coating of any form is formed,
    The ends of all strips are perpendicular to the power supply buses,
    The shape of all the strips is selected in dependence on a parameter of a preset temperature range of the heated spinneret.
    类似技术:
    公开号 | 公开日 | 专利标题
    US3296099A|1967-01-03|Method of making printed circuits
    KR101592661B1|2016-02-05|Capacitive sensor sheet producing method and capacitive sensor sheet
    EP0129697B1|1989-04-26|Method of making printed circuit boards
    US4080513A|1978-03-21|Molded circuit board substrate
    US2884509A|1959-04-28|Heating element containing a conductive mesh
    TW595284B|2004-06-21|Method of drying materials, apparatus therefor and method of manufacturing circuit board
    US3698940A|1972-10-17|Method of making additive printed circuit boards and product thereof
    US6640434B1|2003-11-04|Method of forming an electrical circuit on a substrate
    US4459470A|1984-07-10|Glass heating panels and method for preparing the same from architectural reflective glass
    JP2747096B2|1998-05-06|Method for manufacturing three-dimensional circuit board
    RU2080750C1|1997-05-27|Armored multiple-layer plastic materials for manufacturing of printed circuits, methods for manufacturing of such materials and resulted devices
    CN100413384C|2008-08-20|Multi-layer printed circuit board and fabricating method thereof
    CA1287772C|1991-08-20|Printing
    KR20030090647A|2003-11-28|Method for producing a moulded component comprising an integrated conductor strip and moulded component
    US5015519A|1991-05-14|Molded article with partial metal plating and a process for producing such article
    CN101394710B|2010-12-01|Manufacturing and repairing method for conductive circuit of three dimensional mold interconnecting device
    CN1238873C|2006-01-25|Ceramic electronic parts and its making method
    US2607825A|1952-08-19|Electric capacitor and method of making it
    CN104160457B|2016-03-16|The manufacture method of transparent conductive patterns
    CN100515145C|2009-07-15|Heating element, a method for the production thereof, an article provided with the element and a method for the production thereof
    US2166366A|1939-07-18|Means and method of producing metallic screens
    CN101699939B|2011-04-06|Method for rolling PCB
    US4165394A|1979-08-21|Method of preparation of a substrate made of plastic material for its subsequent metallization
    US20040000427A1|2004-01-01|Process for creating vias for circuit assemblies
    US8522427B2|2013-09-03|Method of manufacturing a printed circuit board
    同族专利:
    公开号 | 公开日
    UA73417C2|2004-06-15|
    NO20025943D0|2002-12-11|
    BG107369A|2003-08-29|
    CN1177511C|2004-11-24|
    PL363098A1|2004-11-15|
    LT2003095A|2004-04-26|
    YU94402A|2004-05-12|
    CN100442945C|2008-12-10|
    IS6977A|2003-10-03|
    IL153402D0|2003-07-06|
    JP2004527884A|2004-09-09|
    CN1436437A|2003-08-13|
    CN1561145A|2005-01-05|
    NO20025943L|2003-02-11|
    CA2443662A1|2002-11-14|
    HU0301395A2|2003-10-28|
    HRP20030787A2|2004-10-31|
    RU2183388C1|2002-06-10|
    EE200200686A|2004-06-15|
    FI20022192A|2003-02-11|
    MXPA03009359A|2004-02-18|
    CZ20032790A3|2004-02-18|
    WO2002091801A1|2002-11-14|
    EP1379104A1|2004-01-07|
    SK12532003A3|2004-04-06|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    2001-04-13|Priority to RU2001109837/09A
    2001-04-13|Priority to RU2001109837
    2001-07-26|Application filed by 오브체스트보 에스 오르가니첸노이 오트베트스트벤노스티쥬 "퍼마 아트토콤+"
    2003-03-12|Publication of KR20030021171A
    优先权:
    申请号 | 申请日 | 专利标题
    RU2001109837/09A|RU2183388C1|2001-04-13|2001-04-13|Method for manufacture of heating radiating panels |
    RU2001109837|2001-04-13|
    [返回顶部]